Interpret and implement Moore’s Law to include all aspects of heterogeneous systems and develop architectures, methodologies, designs, components, materials and manufacturable integration schemes, that will shrink system footprint and improve power and performance.
The Biden-Harris Administration has issued a Notice of Funding Opportunity (NOFO) under the CHIPS and Science Act, offering up to $1.6 billion to advance U.S. semiconductor packaging technologies. This investment supports the National Advanced Packaging Manufacturing Program's goal to establish a competitive and self-sustaining domestic advanced packaging industry, enhancing chip...
Yu-Tao, a student of Professor Iyer, has been awarded the Mahboob Khan Outstanding Liaison Award, a prestigious recognition named in honor of Mahboob Khan, a longtime advocate of the SRC Liaison Program from AMD. The SRC Liaison Program fosters collaboration between university researchers, graduate students, and semiconductor...
As part of President Biden’s Investing in America agenda, the U.S. Department of Commerce announced a $1.6 billion CHIPS for America program to enhance domestic semiconductor advanced packaging capacity through cooperative agreements with industry and academia. Secretary of Commerce Gina Raimondo emphasized that advanced packaging is crucial for job creation...
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